‘Bhumi Pujan’ of Tata Semiconductor facility in Assam: Tata Sons chairman N Chandrasekaran conveys best wishes of Ratan Tata – Times of India



Tata Electronics is set to establish a Rs 27,000 crore chip assembly plant in Assam. The facility, expected to be operational by 2025, will create over 27,000 jobs, according to Tata Sons Chairman N Chandrasekaran.
Speaking on the occasion of the chip plant’s Bhumi Pujan ceremony, Chandrasekaran emphasised the plant’s potential to transform the region into a semiconductor hub.He also said that former chairman of Tata Sons Ratan Tata has conveyed his best wishes for the project and the people of Assam.
“At its capacity it will employ 27,000 people, 15,000 direct jobs and additional 12,000 indirect jobs. We want to move fast. We are trying to accelerate the building of this factory. We hope sometime in 2025 we will be able to complete this facility and quickly start operations,” Chandrasekaran said. Chandrasekaran said that the facility will not only result in technology-based knowledge, skill development, employment and high-end jobs but will create a semiconductor ecosystem with many companies setting up industries to manufacture different components required.
The project is envisioned under the Government of India’s Semiconductor policy being driven by the India Semiconductor Mission and the Government of Assam’s Electronics policy.

Tata Electronics facility to herald industrial development in the state

The ceremony was attended by Assam Chief Minister Himanta Biswa Sarma who said it was a ‘golden day’ for the people of Assam as Bhumi Pujan was performed. “The setting up of this facility will herald industrial development in the state leading to employment opportunities for the youth’, Sarma said after the Bhumi Pujan of the facility at Jagiroad in Morigaon district of Assam.
Sarma hailed the project as a landmark for the state, promising full support to Tata Electronics. The government believes this investment will accelerate industrial development and create opportunities for the state’s youth.

Plant to focus on three key platform technologies

According to the company, the project will focus on three key platform technologies – Wire Bond, Flip Chip, and a differentiated offering called Integrated Systems Packaging (ISP). There are plans to expand the roadmap to advanced packaging technologies in the future.
The project will help industries such as automotive especially the electric vehicle industry communications, network infrastructure, and others to boost their productivity. Semiconductor assembly and testing is a critical part of the semiconductor value chain where wafers manufactured by semiconductor fabs are assembled or packaged and then tested before they are finally used in the desired product.





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